Features
- Heat resistant to 350℃ or more
- Operable in a high vacuum environment, up to 1×10E-6 Pa
- ISO class 1 cleanliness achieved
- Compatible to a wafer size of 300–450mm
Specifications
*Please see the table by scrolling horizontally.
| Wafer Handling Robot (Heat-resistant Vacuum Clean Robot) | ||||||||
|---|---|---|---|---|---|---|---|---|
| Position accuracy | X-axis: ±0.1mm | |||||||
| θ-axis: ±0.006° | ||||||||
| Z-axis: ±0.05mm | ||||||||
| Vacuum seal | Magnetic fluid sealing, welding bellows | |||||||
| Arm drive method | Stainless steel belts | |||||||
*Please see the table by scrolling horizontally.
Applications
- Automated wafer handling methods for various semiconductor wafer production equipments