Sherlock-300IA / Sherlock-300IHAIn-line type
Low vibration mechanism that is suitable for the inspection of the PCBA before reflow process
- Drive mechanism of high rigidity camera
Achieved high-speed and smooth driving of imaging unit with high rigidity X-Y biaxial driving mechanism. - Fixation of PCBA
It is suitable for the PCBA inspection even before reflow process because only camera is driven while the PCBA stands still on a conveyer during inspections. - Control technology of acceleration and slowdown
Adopted a motion control technology for high-speed and low vibration driving, which is developed for the Semiconductor wafer conveyance robot. Minimized the vibration influence on part before fixing it
Compact body is suitable for additional placement to the existing line
*Just an example. It is recommended to place an conveyor between Sherlock-300IA/IHA and reflow oven in case of placing it after relow oven.
Equipment specifications that can be selected according to the mounted components
Capable of handling up to part height 60mm.
Equipment specifications can be changed according to the height of the part to be inspected.
Dedicated development of a telecentric optical system with a deep depth of field enables high-precision inspection of product numbers and polarities on the surfaces of high-profile components.
Enhancement of data creation support functions
A number of functions are available to assist the inspection setup.
While viewing the image, the "template" function inputs the appropriate inspection sets when the actual inspection position is specified.
Specifications
*Please see the table by scrolling horizontally.
| Sherlock-300IA | Sherlock-300IHA | ||
|---|---|---|---|
| PCBAs to be inspected | M size | ○ | |
| L size | - | ||
| Dimensions | 50mm (W)×50mm (D) to 330mm (W)×250mm (D) | ||
| Thickness of PCBA | 0.5 to 2.0mm | ||
| Maximum weight of PCBA | 3kg | ||
| Height limit of PCBA (Clearance) |
Upper side | 25mm (Resolution：12.4μm/pixel) 30mm (Resolution：18.7μm/pixel) |
60mm |
| Under side | 70mm | ||
| Resolution | 12.4μm/pixel 18.7μm/pixel (selectable at the time of order) |
18.7μm/pixel | |
| Minimum components to be inspected (JIS) | 0402 (Resolution：12.4μm/pixel) 0603 (Resolution：18.7μm/pixel) |
0603 | |
| Inspection speed | 5,000mm2/s (*Resolution：18.7 μm/pixel) |
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| Main inspection items | Component inspection | Missing parts, displacement, defective standing, polarity, foreign objects, wrong parts, inversion, character recognition (OCR) |
|
| Solder inspection | Excess, Insufficient, unsoldered, bridges, solder ball | ||
| Imaging range | 25.4mm×13.5mm (Resolution：12.4μm/pixel) 38.3mm×20.3mm (Resolution：18.7μm/pixel) |
38.3mm×20.3mm | |
| Repeatability of positioning | ±50μm | ||
| Camera | 2M Pixel | ||
| Lighting | RGB + warm white LED | ||
| Flow direction of PCBA | Right-to-Left / Left-to-Right (selectable at the time of order) |
||
| PCBA clamping unit | Air clamp | ||
| Width adjustment for transferring conveyor | Automatic | ||
| Passline | 920±50mm | ||
| Reference position for PCBA width | Front | ||
| Monitor | 21.5" touch panel display | ||
| PC | OS | Windows 11 Professional 64bit Japanese/English (selectable at the time of order) |
|
| Memory | 16GB | ||
| Interface between equipments | Conformance to SMEMA standard | ||
| Environment conditions for operation | 10 to 35℃/30 to 80%RH (no condensation) | ||
| Environment conditions for storage | -10 to 60℃/30 to 80%RH (no condensation) | ||
| Power supply | AC100 to 240V (single phase) 50/60Hz |
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| Compressed air consumption | Compressed air ：0.5MPa Air consumption ：5Nℓ/min |
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| Dimensions of main unit (excluding protruding portion) |
W620×D758×H1,294mm * At a pass line height of 900mm |
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| Weight (excluding PC) | 154kg | ||
*Please see the table by scrolling horizontally.